USB3300 Features
	USB3300 Applications
	Go to Hi-Speed USB Page
	SMSC Endorses ULPI Hi-Speed USB Transceiver Interface
	Freescale MPC8349E PowerQUICC™ II Pro USB-IF Certification
	Data Sheet, Application Notes, Drivers and Design Tools

General Description

The USB3300 is an industrial temperature Hi-Speed USB Physical Layer Transceiver (PHY). The USB3300 uses a low pin count interface (ULPI) to connect to a ULPI compliant Link layer. The ULPI interface reduces the UTMI+ interface from 54 pins to 12 pins using a method of in-band signaling and status byte transfers between the Link and PHY.

This PHY was designed from the start with the ULPI interface. No UTMI to ULPI wrappers are used in this design which provides a seamless ULPI to Link interface. The result is a PHY with a low latency transmit and receive time. SMSC's low latency high speed and full speed receiver provide the option of re-using existing UTMI Links with a simple wrapper to convert UTMI to ULPI.

The ULPI interface allows the USB3300 PHY to operate as a device, host, or an On-The-Go (OTG) device. Designs using the USB3300 PHY as a device, can add host and OTG capability at a later date with no additional pins.

The ULPI interface, combined with SMSC's proprietary technology, makes the USB3300 the ideal method of adding Hi-Speed USB to new designs. The USB3300 features an industry leading small footprint package (5mm by 5mm) with sub 1mm height. In addition the USB3300 integrates all DP and DM termination resistances and requires a minimal number of external components.

Features

	USB-IF Hi-Speed certified to the Universal Serial Bus Specification Rev 2.0
	Interface compliant with the ULPI Specification revision 1.1 in 8-bit mode
	Industry standard UTMI+ Low Pin Interface (ULPI) Converts 54 UTMI+ signals into a standard 12 pin Link controller interface
	54.7mA Unconfigured Current (typical) - ideal for bus powered applications
	83uA suspend current (typical) - ideal for battery powered applications
	Latch-Up performance exceeds 150 mA per EIA/JESD 78, Class II
	ESD protection levels of ±8kV HBM without external protection devices
	Integrated protection to withstand IEC61000-4-2 ESD tests (±8kV contact and ±15kV air) per 3rd party test facility
	Supports FS pre-amble for FS hubs with a LS device attached (UTMI+ Level 3)
	Supports HS SOF and LS keep-alive pulse
	Includes full support for the optional On-The-Go (OTG) protocol detailed in the On-The-Go Supplement Revision 1.0a specification
	Supports the OTG Host Negotiation Protocol (HNP) and Session Request Protocol (SRP)
	Allows host to turn VBUS off to conserve battery power in OTG applications
	Supports OTG monitoring of VBUS levels with internal comparators. Includes support for an external VBUS or fault monitor.
	Low Latency Hi-Speed Receiver (43 Hi-Speed clocks Max) allows use of legacy UTMI Links with a ULPI wrapper
	Integrated Pull-up resistor on STP for interface protection allows a reliable Link/PHY start-up with slow Links (software configured for low power)
	Internal 1.8 volt regulators allow operation from a single 3.3 volt supply
	Internal short circuit protection of ID, DP and DM lines to VBUS or ground
	Integrated 24MHz Crystal Oscillator supports either crystal operation or 24MHz external clock input
	Internal PLL for 480MHz Hi-Speed USB operation
	Industrial Operating Temperature -40°C to +85°C
	32 pin, QFN lead-free RoHS Compliant package (5 x 5 x 0.90 mm height)

Applications

The USB3300 is the ideal companion to any ASIC, SoC or FPGA solution designed with a ULPI Hi-Speed USB host, peripheral or OTG core.

The USB3300 is well suited for:

	Cell Phones
	PDAs
	MP3 Players
	Scanners
	External Hard Drives
	Digital Still and Video Cameras
	Portable Media Players
	Printers

USB3300 Block Diagram

USB3300: Measured Eye Diagram of High-Speed (480 Mbps) Test Mode Test Packet
as Defined in Rev. 2.0 of the USB 2.0 Specification

USB3300 Data Sheet, Application Notes,
Drivers and Design Tools

Description	File Name	File Size	Date
USB3300 Data Brief	3300db.pdf	254K	11/7/07
USB3300 Data Sheet	3300.pdf	811K	11/7/07
Evaluation Boards
EVB-USB3300    Schematic, ORCAD 7.2    Schematic, PDF    Bill of Materials, Excel    Bill of Materials, PDF    User Guide, PDF    Gerber Files    Gerber Files, PDF	evb3300.dsn evb3300.pdf evb3300bom.xls evb3300bom.pdf evb3300user.pdf evb3300gerber.zip evb3300gerber_pdf.zip	5162K 91K 32K 25K 601K 723K 620K	7/29/05 7/29/05 8/2/05 8/2/05 12/18/06 10/28/05 8/1/05
EVB-USB3300-XLX for Xilinx Starter Kits The EVB-USB3300-XLX is a USB PHY Daughter Card compatible with the Xilinx Generic Interface (XGI) headers on several Xilinx Development Boards such as the ML32X, ML40X and ML50X. A complete reference design is described in the Xilinx Application Note XAPP997.
User Guide, PDF	evb3300xlxuser.pdf	136K	6/29/07
Order the EVB-USB3300-XLX from Diligent, Inc.
Application Notes
Application Note 13-10: USB3300 PHY Layout Guidelines	an1310.pdf	638K	1/12/07
Other Information
Freescale MPC8349E PowerQUICC™ II Pro USB-IF Certification
USB3300 Frequently Asked Questions (FAQ)
Using the Adobe® Acrobat® Reader	aacrobat.html
ULPI Press Releases
SMSC Provides Industry's First ULPI Stand-Alone Transceiver for Hi-Speed USB Industry Specification
SMSC and TransDimension Achieve Industry's First USB-IF OTG Certification of Hi-Speed USB Controller with Stand-Alone Transceiver
SMSC and TransDimension Team to Achieve First USB-IF Certification of ULPI Controller and Transceiver
New Low-Pin, Hi-Speed USB Transceiver Interface Endorsed by Leading USB Connectivity Providers
Links to Other USB-Related Sites Note: These links are provided under the terms and conditions of SMSC's Web Site Use Agreement. Please refer to Legal Information. About USB Implementer's Forum, Inc. - http://www.usb.org/about USB Info: Frequently Asked Questions - http://www.usb.org/about/faq/ Certified GOLD LINK Serial Interface Engine (SIE) Partners: Mentor Graphics - Mentor Graphics USB IP Products Vreelin Engineering - USB 2.0 High Speed Device Interface ASICS World Services, Ltd. - USB 2.0 On-The-Go IP Core Evatronix SA - USB Solutions Specifications: ULPI and UTMI+ (Downloadable Zip File - 2649K) T&MT USB-IF Documentation including USB 2.0 Specification and USB On-The-Go Supplement

Although the information in this document has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to product descriptions and specifications at any time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does not convey any licenses under any patent rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard Terms of Sale Agreement dated before the date of your order. Products may contain design defects or errors known as anomalies which may cause a product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC's website at http://www.smsc.com. SMSC and the SMSC logo are registered trademarks of Standard Microsystems Corporation ("SMSC"). Other names mentioned may be trademarks of their respective holders. All claims made herein speak as of the date of this material. The company does not undertake to update such statements. (2/09)